Job Responsibilities
1. Development of Direct Bonding Copper or the Active Metal Bonding Product. 2. Organize sample making, testing and certification of new products; 3. According to customer demand, develop new processes and technologies or optimize and improve the original processes. 4. Evaluate the feasibility of new product samples, small batch and large batch production, and guide the process to analyze and improve the abnormalities. 5. Handover of the relevant data of new product mass production.
Job Requirements
1. Bachelor degree with a major in Chemistry or Material, if you have the Master or above degree will be a plus. 2. Experience in mass production of ceramic substrate in Direct Bonding Copper or the Active Metal Bonding solder. 3. Strong ability to analyze and solve problems, rigorous and steady work, and able to bear pressure. 4. Good coordination and communication skills and good team spirit.
Required Languages
English, Mandarin
Job Details
Position type
Electronics/semiconductor engineer
Experience
3~5 years